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US 12,616,035 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeKioxia Corporation
InventorsMakoto Minaminaka, Masahiko Takeuchi
Life of this patent
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Abstract
A semiconductor device according to the present embodiment includes a resin layer, ink, and a film. The ink is provided on an upper surface of the resin layer. The film coats the resin layer and the ink. Surface roughnesses of the film are different between in a first region where the ink is provided and in a second region where the ink is not provided.
Claims19
A semiconductor device comprising:
- a resin layer;
- ink provided on an upper surface of the resin layer;
- and
- a conductive film coating the resin layer and the ink,
- wherein the conductive film has a first region where the ink is provided and a second region where the ink is not provided, and a surface roughness of the conductive film in the first region is different from a surface roughness of the conductive film in the second region.
2 more elements
A semiconductor device comprising:
- a resin layer;
- ink provided on an upper surface of the resin layer;
- and
- a film coating the resin layer and the ink,
- wherein the film has a first region where the ink is provided and a second region where the ink is not provided, and a surface roughness of the film in the first region is different from a surface roughness of the film in the second region,
- wherein the film has a first film, and a second film provided on the first film and having a different color from that of the first film, and
- wherein the first film is exposed from the second film in the first region where the ink is provided, and is not exposed from the second film in the second region where the ink is not provided.
4 more elements
Dependencies are inferred from the claim text.