US 2026/0239985 A1 · SEMICONDUCTOR PACKAGE STRUCTURE

Abstract

A semiconductor package structure includes a first semiconductor die, a second semiconductor die, and a conductive structure. The first semiconductor die includes a electrical component and an inductor disposed in a dielectric layer. The first semiconductor die also includes a semiconductor substrate disposed over the dielectric layer. The first semiconductor die also includes a first row of guarding-through vias extending through the semiconductor substrate and between the electrical component and the inductor. The second semiconductor die vertically overlaps the first row of through vias. The conductive structure is disposed over the first semiconductor die and electrically couples the second semiconductor die to the first row of guarding-through vias.

Claims20

Dependent claims

A semiconductor package structure, comprising:

a first semiconductor die, comprising:
an electrical component and an inductor disposed in a dielectric layer;
a semiconductor substrate disposed over the dielectric layer;
and
a first row of guarding-through vias extending through the semiconductor substrate and between the electrical component and the inductor;
a second semiconductor die vertically overlapping the first row of through vias;
and
a conductive structure disposed over the first semiconductor die and electrically coupling the second semiconductor die to the first row of guarding-through vias.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor package structure

Life of this patent

Semiconductor package structure

Life of this patent

Abstract

Claims20