Semiconductor device and semiconductor device manufacturing method

A semiconductor device comprising:

• a substrate on which wiring is formed;
• a first semiconductor element provided on or above the substrate;
• a second semiconductor element provided on or above the first semiconductor element;
• a first resin provided in at least part of a region between the first semiconductor element and the substrate, the first resin being an underfill resin;
• a second resin different from the first resin and provided in at least part of a region between the second semiconductor element and the substrate, the second resin being a mold resin;
• a member having a thermal conductivity higher than a thermal conductivity of the first resin and a thermal conductivity of the second resin, provided between the first resin and the second resin, having a part overlapping with and directly contacting an upper surface of the first semiconductor element, having another part overlapping with a first wiring part as part of the wiring in a top view, including a through hole in the part overlapping with the upper surface of the first semiconductor element, and including no through hole in a part contacting with the second resin;
• and
• a third resin provided between the second semiconductor element and the member,
• wherein:
• the first resin is in direct contact with an upper surface of the substrate, a lower surface of the first semiconductor element, and the member, and
• the third resin is a die attach film that is different from the first resin and the second resin.