Camera module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorHongkwan Kim
Life of this patent
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Abstract
A camera module includes a housing configured to accommodate a lens barrel; a first circuit board, disposed below the housing, including a first ground pad; a shield cover configured to cover the housing; a second circuit board, disposed on one side surface of the housing, including a second ground pad corresponding to the first ground pad; a first solder connecting the first ground pad and the second ground pad; and a second solder connecting the shield cover and the second ground pad. The second ground pad comprises a first connection part connected to the first ground pad through the first solder and a second connection part connected to the shield cover through the second solder.
Claims15
A camera module, comprising:
- a housing configured to accommodate a lens barrel;
- a first circuit board, disposed below the housing, comprising a first ground pad;
- a shield cover configured to cover the housing;
- a second circuit board, disposed on one side surface of the housing, comprising a second ground pad corresponding to the first ground pad;
- a first solder connecting the first ground pad and the second ground pad;
- and
- a second solder connecting the shield cover and the second ground pad,
- wherein the second ground pad comprises a first connection part connected to the first ground pad through the first solder and a second connection part connected to the shield cover through the second solder.
A camera module, comprising:
- a housing configured to accommodate a lens barrel;
- a first circuit board, disposed below the housing, comprising a first ground pad;
- a shield cover, disposed to cover the housing, comprising a surface and a through hole extending through the surface;
- and
- a second circuit board, disposed on one side surface of the housing, comprising a second ground pad corresponding to the first ground pad,
- wherein the second ground pad is disposed to extend from a position connected to the first ground pad to a position corresponding to the through hole.
A camera module, comprising:
- a housing configured to accommodate a lens barrel;
- a first circuit board, disposed below the housing, comprising a first ground pad;
- a shield cover configured to cover the housing;
- a second circuit board, disposed on one side surface of the housing, comprising a second ground pad corresponding to the first ground pad;
- a first solder connecting the first ground pad and the second ground pad;
- and
- a second solder connecting the shield cover and the second ground pad,
- wherein the second ground pad comprises a first connection part connected to the first ground pad through the first solder and a second connection part connected to the shield cover through the second solder, and
- the first solder and the second solder are spaced apart from each other.
Dependencies are inferred from the claim text.