H10W 42/267
Patterned shielding planes
Official title: {Patterned shielding planes}
H10W42/267 (Patterned shielding planes) appears on 202 US grants and 242 published applications in this corpus.
Search patents in H10W- Granted patents
- 202
- Published applications
- 242
- Assignees
- 105
- Inventors
- 511
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 7 |
| 2005 | 1 | 4 |
| 2006 | 6 | 4 |
| 2007 | 4 | 7 |
| 2008 | 5 | 3 |
| 2009 | 6 | 8 |
| 2010 | 4 | 3 |
| 2011 | 8 | 6 |
| 2012 | 4 | 2 |
| 2013 | 4 | 2 |
| 2014 | 4 | 8 |
| 2015 | 4 | 4 |
| 2016 | 10 | 9 |
| 2017 | 7 | 8 |
| 2018 | 8 | 10 |
| 2019 | 12 | 13 |
| 2020 | 12 | 21 |
| 2021 | 12 | 23 |
| 2022 | 16 | 20 |
| 2023 | 15 | 31 |
| 2024 | 25 | 20 |
| 2025 | 17 | 11 |
| 2026 | 12 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package, semiconductor module, semiconductor device, and semiconductor package manufacturing method20 Aug 2026US 2026/0247982 A1Sony Semiconductor Solutions Corporation
- Interconnect substrate and method of making6 Aug 2026US 2026/0231779 A1Deca Technologies USA, Inc.
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Most cited
By later US patents
- Multilayer wiring structure283US 5,723,908 AKabushiki Kaisha Toshiba · 1998
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