Radio frequency module and communication device

A radio frequency module comprising:

• a first module substrate that has a first main surface facing a second main surface;
• a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface;
• multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface;
• and
• a LC component that is disposed in the first module substrate and that is an inductor or a capacitor,
• wherein the second module substrate is a printed circuit board, and
• wherein the first module substrate is a low-temperature co-fired ceramic substrate or a high-temperature co-fired ceramic substrate.

A communication device comprising:

• a signal processing circuit that processes a radio frequency signal;
• and
• a radio frequency module that transmits the radio frequency signal between the signal processing circuit and an antenna, the radio frequency module including
• a first module substrate that has a first main surface facing a second main surface;
• a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface;
• multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface;
• and
• a LC component that is disposed in the first module substrate and that is an inductor or a capacitor,
• wherein a relative dielectric constant of the first module substrate is higher than a relative dielectric constant of the second module substrate.