Electronic packaging structure and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsChin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan
Life of this patent
Estimating the term…
Abstract
An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.
Claims14
An electronic packaging structure, comprising:
- a first circuit structure, comprising a bottom conductive plate having at least one cavity;
- a second circuit structure, the first circuit structure being disposed thereon, wherein the first circuit structure and the second circuit structure are electrically connected to each other;
- and at least one electronic device, disposed on the second circuit structure, wherein the electronic device is disposed corresponding to the cavity of the bottom conductive plate of the first circuit structure.
A manufacturing method of an electronic packaging structure, comprising:
- providing a first circuit structure, comprising a bottom conductive plate having at least one cavity;
- providing a second circuit structure;
- disposing at least one electronic device on the second circuit structure;
- and
- disposing the first circuit structure on the second circuit structure with the electronic device disposed thereon, wherein the first circuit structure and the second circuit structure are electrically connected to each other, and the electronic device is disposed corresponding to the cavity of the first circuit structure.
Dependencies are inferred from the claim text.