Electronic device
AssigneesSTMicroeletronics (Grenoble 2) SAS, STMicroeletronics (Alps) SAS
InventorsOlivier Ptak, Ouafa Hajji, Georg Kimmich
Life of this patent
Estimating the term…
Abstract
An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material.
Claims23
An electronic device comprising:
- an electronic chip assembled on a substrate in a first region of the electronic device;
- a first coating layer of a first coating material covering at least one surface of the electronic chip facing away from the substrate;
- and
- a radiation element of an antenna of the electronic device, the radiation element being arranged in the first coating layer in a second region of the electronic device offset from the first region so that the radiation element is separated from the substrate by at least a portion of the first coating layer and is offset from and does not overlap any portion of the electronic chip, wherein the radiation element comprises a central portion surrounded by raised outer edges, wherein the central portion of the radiation element is covered with a protection material.
A method of manufacturing an electronic device comprising:
- providing an electronic chip assembled on a substrate in a first region of the electronic device;
- forming a first coating layer of a first coating material to cover at least a surface of the electronic chip facing away from the substrate;
- forming a radiation element in the first coating layer in a second region of the electronic device offset from the first region so that the radiation element is separated from the substrate by at least a portion of the first coating layer and is offset from and does not overlap any portion of the electronic chip, wherein the radiation element comprises a central portion surrounded by raised outer edges;
- and
- forming an additional layer of material in the central portion of the radiation element.
An electronic system comprising:
- a first electronic device comprising:
- a first electronic chip assembled on a first substrate in a first region of the first electronic device;
- a first coating layer of a first coating material covering at least one surface of the first electronic chip facing away from the first substrate;
- and
- a first radiation element of a first antenna of the first electronic device, the first radiation element being arranged in the first coating layer in a second region of the first electronic device offset from the first region of the first electronic device so that the first radiation element is separated from the first substrate by a portion of the first coating layer and is offset from and does not overlap any portion of the first electronic chip, wherein the first radiation element comprises a central portion surrounded by raised outer edges and wherein the central portion of the first radiation element is covered with a first protection material;
- and
- a second electronic device comprising:
- a second electronic chip assembled on a second substrate in a first region of the second electronic device;
- a second coating layer of a second coating material covering at least one surface of the second electronic chip facing away from the second substrate;
- and
- a second radiation element of a second antenna of the second electronic device, the second radiation element being arranged in the second coating layer in a second region of the second electronic device offset from the first region of the second electronic device so that the second radiation element is separated from the second substrate by a portion of the second coating layer and is offset from and does not overlap any portion of the second electronic chip, wherein the second radiation element comprises a central portion surrounded by raised outer edges, wherein the central portion of the second radiation element is covered with a second protection material, and
- wherein the first electronic device is configured to exchange a first communication signal via the first radiation element and the second electronic device is configured to exchange a second communication signal via the second radiation element.
Dependencies are inferred from the claim text.