Electronic device including an inductor
AssigneeFreescale Semiconductor, Inc.
InventorJames Jen-Ho Wang
Life of this patent
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Abstract
An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.
Claims20
An electronic device comprising:
- a substrate;
- an interconnect level overlying the substrate, wherein the interconnect level comprises a first interconnect and a second interconnect;
- a shock-absorbing layer overlying the interconnect level, wherein the shock-absorbing layer includes a first opening over the first interconnect and a second opening over the second interconnect;
- and
- a first inductor including conductive traces and at least one looped wire, wherein:
- the conductive traces include a first conductive trace and a second conductive trace;
- a first via pad portion of the first conductive trace extends to the first opening of the shock-absorbing layer and is electrically connected to the first interconnect, and a primary pad portion of the first conductive trace overlies the shock-absorbing layer;
- a secondary pad portion of the second conductive trace overlies the shock-absorbing layer, and a via portion of the second conductive trace extends to the second opening of the shock-absorbing layer and is electrically connected to the second interconnect;
- a first looped wire of the at least one wire is wire bonded to the primary pad portion of the first conductive trace;
- and
- the first looped wire or a second looped wire of the at least one wire is wire bonded to the secondary pad portion of the second conductive trace.
Dependencies are inferred from the claim text.