H10W 20/039
Also covering sidewalls of the conductive structures
Official title: {also covering sidewalls of the conductive structures}
H10W20/039 (Also covering sidewalls of the conductive structures) appears on 766 US grants and 799 published applications in this corpus.
Search patents in H10W- Granted patents
- 766
- Published applications
- 799
- Assignees
- 157
- Inventors
- 1,259
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 7 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 11 | 0 |
| 2000 | 17 | 0 |
| 2001 | 21 | 8 |
| 2002 | 23 | 24 |
| 2003 | 19 | 16 |
| 2004 | 16 | 16 |
| 2005 | 16 | 33 |
| 2006 | 18 | 27 |
| 2007 | 27 | 30 |
| 2008 | 11 | 21 |
| 2009 | 16 | 21 |
| 2010 | 22 | 21 |
| 2011 | 22 | 11 |
| 2012 | 14 | 25 |
| 2013 | 16 | 21 |
| 2014 | 30 | 47 |
| 2015 | 25 | 35 |
| 2016 | 46 | 42 |
| 2017 | 55 | 49 |
| 2018 | 33 | 34 |
| 2019 | 38 | 45 |
| 2020 | 48 | 39 |
| 2021 | 42 | 55 |
| 2022 | 39 | 45 |
| 2023 | 26 | 43 |
| 2024 | 39 | 43 |
| 2025 | 28 | 27 |
| 2026 | 17 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device with polymer liner and method for fabricating the same15 Sep 2026US 12,740,389 B2Nanya Technology Corporation
- Integrated circuit devices including a conductive via and methods of forming the same15 Sep 2026US 12,740,395 B2Samsung Electronics Co., Ltd.
- Wire structure for low resistance interconnects14 Jul 2026US 12,685,137 B2International Business Machines Corporation
- Incorporation of superlattice semi-metals for scaled interconnects23 Jun 2026US 12,666,956 B2Intel Corporation
- Interconnect structure16 Jun 2026US 12,660,593 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit devices including a conductive via and methods of forming the same30 Jul 2026US 2026/0223658 A1Samsung Electronics Co., Ltd.
- Interconnect structure including vertical conductors and method for manufacturing the same30 Jul 2026US 2026/0223664 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and methods of formation23 Jul 2026US 2026/0214975 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device23 Jul 2026US 2026/0215244 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method for manufacturing semiconductor device9 Jul 2026US 2026/0198286 A1Rapidus Corporation
Most cited
By later US patents
- Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections290US 5,739,579 AIntel Corporation · 1998
- Air gap spacer formation for nano-scale semiconductor devices176US 10,418,277 B2International Business Machines Corporation · 2019
- Barrier layer cladding around copper interconnect lines154US 6,084,302 AMicron Technologies, Inc. · 2000
- Method for forming multileves interconnections for semiconductor fabrication153US 5,817,572 AIntel Corporation · 1998
- High performance interconnect system for an integrated circuit132US 5,117,276 AFairchild Camera and Instrument Corporation · 1992