H05K 2203/1377
Protective layers
H05K2203/1377 (Protective layers) appears on 336 US grants and 297 published applications in this corpus.
Search patents in H05K- Granted patents
- 336
- Published applications
- 297
- Assignees
- 213
- Inventors
- 881
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 9 | 0 |
| 1998 | 18 | 0 |
| 1999 | 15 | 0 |
| 2000 | 14 | 0 |
| 2001 | 9 | 6 |
| 2002 | 10 | 14 |
| 2003 | 3 | 13 |
| 2004 | 14 | 13 |
| 2005 | 10 | 11 |
| 2006 | 6 | 13 |
| 2007 | 8 | 16 |
| 2008 | 6 | 13 |
| 2009 | 8 | 19 |
| 2010 | 11 | 12 |
| 2011 | 4 | 9 |
| 2012 | 11 | 10 |
| 2013 | 5 | 7 |
| 2014 | 6 | 7 |
| 2015 | 10 | 15 |
| 2016 | 5 | 13 |
| 2017 | 11 | 10 |
| 2018 | 15 | 10 |
| 2019 | 8 | 8 |
| 2020 | 9 | 11 |
| 2021 | 9 | 10 |
| 2022 | 7 | 8 |
| 2023 | 4 | 8 |
| 2024 | 12 | 17 |
| 2025 | 6 | 17 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Method for manufacturing conductive circuit board26 May 2026US 12,641,731 B2Tong Hsing Electronic Industries, Ltd.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Circuit board10 Feb 2026US 12,550,269 B2LG Innotek Co., Ltd.
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,348 B2Samsung Electro-Mechanics Co., Ltd.
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Flexible circuit board, cof module, and electronic device including same30 Jul 2026US 2026/0223284 A1LG Innotek Co., Ltd.
- Method for forming blind vias and method for manufacturing packaging substrate2 Jul 2026US 2026/0190241 A1Absolics Inc.
- System and process for manufacturing flexible circuit board by laser cutting28 May 2026US 2026/0150198 A1Huaian M & T New Material Technology Co., Ltd
- Structure Utilizing a PCB as an Interconnecting Carrier for Heating Elements9 Apr 2026US 2026/0101443 A1Mec Addheat (Kaiping) Co. ,Ltd.
Most cited
By later US patents
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Thin substrate micro-via interconnect167US 5,493,096 AGrumman Aerospace Corporation · 1996
- Semiconductor flip chip package145US 6,018,196 AW. L. Gore & Associates, Inc. · 2000
- Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias130US 6,103,992 AW. L. Gore & Associates, Inc. · 2000