Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
AssigneeW. L. Gore & Associates, Inc.
InventorDavid B. Noddin
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Abstract
A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each pulse trepanned in the first predetermined pattern has a first energy density per pulse. Then, the through-via is laser drilled using a plurality of laser pulses that are trepanned in a second predetermined pattern. Each pulse trepanned in the second predetermined pattern has a second energy density per pulse that is greater than the first energy density per pulse. The second predetermined pattern is within the first predetermined pattern.
Claims33
A method for forming a through-via in a laminated substrate, comprising the steps of:
- laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern, each pulse trepanned in the first predetermined pattern having a first energy density per pulse;
- and
- laser drilling the through-via using a plurality of laser pulses that are trepanned in a second predetermined pattern, each pulse trepanned in the second predetermined pattern having a second energy density per pulse, the second energy density per pulse being greater than the first energy density per pulse, the second predetermined pattern being within the first predetermined pattern.
Dependencies are inferred from the claim text.