H05K 2203/13
Moulding and encapsulation
Official title: Moulding and encapsulation; Deposition techniques; Protective layers
H05K2203/13 (Moulding and encapsulation) appears on 1,913 US grants and 1,974 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,913
- Published applications
- 1,974
- Assignees
- 965
- Inventors
- 4,676
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 9 | 0 |
| 1982 | 2 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 22 | 0 |
| 1989 | 23 | 0 |
| 1990 | 25 | 0 |
| 1991 | 17 | 0 |
| 1992 | 22 | 0 |
| 1993 | 37 | 0 |
| 1994 | 28 | 0 |
| 1995 | 34 | 0 |
| 1996 | 26 | 0 |
| 1997 | 20 | 0 |
| 1998 | 37 | 0 |
| 1999 | 24 | 0 |
| 2000 | 21 | 0 |
| 2001 | 32 | 10 |
| 2002 | 25 | 33 |
| 2003 | 20 | 37 |
| 2004 | 38 | 42 |
| 2005 | 26 | 48 |
| 2006 | 19 | 61 |
| 2007 | 36 | 69 |
| 2008 | 29 | 82 |
| 2009 | 40 | 71 |
| 2010 | 52 | 94 |
| 2011 | 48 | 64 |
| 2012 | 64 | 55 |
| 2013 | 49 | 67 |
| 2014 | 51 | 85 |
| 2015 | 54 | 96 |
| 2016 | 65 | 89 |
| 2017 | 83 | 124 |
| 2018 | 102 | 125 |
| 2019 | 126 | 119 |
| 2020 | 112 | 133 |
| 2021 | 112 | 103 |
| 2022 | 91 | 95 |
| 2023 | 67 | 74 |
| 2024 | 85 | 81 |
| 2025 | 54 | 72 |
| 2026 | 29 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Conformal electromagnetic interference shielding film18 Aug 2026US 12,713,572 B2Microsoft Technology Licensing, LLC
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991