Conformal electromagnetic interference shielding film

A method for manufacturing a conformal electromagnetic interference (EMI) shielding film, the method comprising:

• forming a thermal-forming film layer;
• forming an electrically conductive film layer on the thermal-forming film layer with a plurality of voids;
• forming the plurality of voids in a first area of the electrically conductive film layer at a first size, and forming the plurality of voids in a second area of the electrically conductive film layer at a second size different than the first size;
• and
• applying heat to conformally coat the thermal-forming film layer over one or more electronic components mounted on a substrate and deform the plurality of voids to allow the electrically conductive film layer formed on an opposite side of the thermal-forming film layer from the substrate to conform together with the thermal-forming film layer.

An electromagnetic interference (EMI) shielded circuit board, comprising:

• a circuit board including one or more electronic components mounted on a substrate;
• and
• a conformal EMI shielding film including:
• a thermal-forming film layer configured to conformally coat over the one or more electronic components with application of heat;
• and
• an electrically conductive film layer formed on an opposite side of the thermal-forming film layer from the substrate and having a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer, wherein
• in a first area of the electrically conductive film layer, the plurality of voids are formed at a first size, and in a second area of the electrically conductive film layer, the plurality of voids are formed at a second size different than the first size.