H05K 2203/1333
Deposition techniques
Official title: Deposition techniques, e.g. coating
H05K2203/1333 (Deposition techniques) appears on 470 US grants and 405 published applications in this corpus.
Search patents in H05K- Granted patents
- 470
- Published applications
- 405
- Assignees
- 293
- Inventors
- 1,185
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 9 | 0 |
| 1988 | 8 | 0 |
| 1989 | 13 | 0 |
| 1990 | 11 | 0 |
| 1991 | 9 | 0 |
| 1992 | 13 | 0 |
| 1993 | 22 | 0 |
| 1994 | 15 | 0 |
| 1995 | 10 | 0 |
| 1996 | 13 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 15 | 4 |
| 2002 | 7 | 10 |
| 2003 | 13 | 19 |
| 2004 | 16 | 19 |
| 2005 | 11 | 18 |
| 2006 | 6 | 15 |
| 2007 | 7 | 22 |
| 2008 | 10 | 21 |
| 2009 | 10 | 16 |
| 2010 | 17 | 24 |
| 2011 | 13 | 13 |
| 2012 | 17 | 7 |
| 2013 | 9 | 12 |
| 2014 | 13 | 24 |
| 2015 | 8 | 15 |
| 2016 | 16 | 15 |
| 2017 | 15 | 20 |
| 2018 | 14 | 21 |
| 2019 | 15 | 19 |
| 2020 | 10 | 14 |
| 2021 | 15 | 21 |
| 2022 | 12 | 11 |
| 2023 | 10 | 9 |
| 2024 | 11 | 15 |
| 2025 | 6 | 14 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/135Electrophoretic deposition of insulating materialIndexing code167
- H05K 2203/1366Spraying coatingIndexing code101
- H05K 2203/1338Chemical vapour depositionIndexing code80
- H05K 2203/1344Spraying small metal particles or droplets of molten metalIndexing code72
- H05K 2203/1355Powder coating of insulating materialIndexing code33
- H05K 2203/1361Coating by immersion in coating bathIndexing code26
- H05K 2203/1372Coating by using a liquid waveIndexing code4
Recent patents
- Reusable composite stencil for spray processes14 Apr 2026US 12,600,159 B2Intel Corporation
- Barrier layer for an electrical device14 Apr 2026US 12,604,419 B2Honeywell International Inc.
- Protective coating composition for circuit board27 Jan 2026US 12,534,638 B2Samsung Electronics Co., Ltd.
- Protective coating13 Jan 2026US 12,521,756 B2
- RF cover layer23 Dec 2025US 12,507,347 B2Raytheon Company
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Fully 3D Printed mm-Wave Board Embedded Designs with High Integration Levels19 Mar 2026US 2026/0082489 A1Northrop Grumman Systems Corporation
- Techniques for manufacturing a wearable device5 Mar 2026US 2026/0064165 A1Oura Health Oy
- Techniques for equalizing dome heights for wearable devices5 Mar 2026US 2026/0064166 A1Oura Health Oy
Most cited
By later US patents
- Precision spray processes for direct write electronic components212US 6,251,488 B1Optomec Design Company · 2001
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Structure having laser ablated features and method of fabricating154US 6,919,514 B2International Business Machines Corporation · 2005
- Forming via holes in a multilevel substrate in a single step139US 5,227,013 AMicroelectronics and Computer Technology Corporation · 1993
- Method for producing laminated film/metal structures for known good die ("KG") applications119US 5,776,824 AMicron Technology, Inc. · 1998