H05K 2203/135
Electrophoretic deposition of insulating material
H05K2203/135 (Electrophoretic deposition of insulating material) appears on 167 US grants and 93 published applications in this corpus.
Search patents in H05K- Granted patents
- 167
- Published applications
- 93
- Assignees
- 72
- Inventors
- 304
- Latest grant
- 12 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 10 | 0 |
| 1993 | 12 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 1 |
| 2002 | 3 | 9 |
| 2003 | 8 | 14 |
| 2004 | 12 | 13 |
| 2005 | 9 | 11 |
| 2006 | 3 | 8 |
| 2007 | 6 | 7 |
| 2008 | 6 | 9 |
| 2009 | 4 | 7 |
| 2010 | 5 | 4 |
| 2011 | 3 | 1 |
| 2012 | 6 | 2 |
| 2013 | 3 | 0 |
| 2014 | 3 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 0 | 2 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods and processes for forming electrical circuitries on three-dimensional geometries12 Apr 2022US 11,304,303 B2Dujud LLC
- Insulation systems and methods of depositing insulation systems6 Apr 2021US 10,968,529 B2General Electric Company
- Embedded thin films28 Aug 2018US 10,064,283 B2The Research Foundation for The State University of New York
- Method for electrophoretically depositing a film on an electronic assembly12 Apr 2016US 9,313,897 B2Infineon Technologies AG
- Embedded thin films11 Nov 2014US 8,882,983 B2The Research Foundation for The State University of New York
- Methods and processes for forming electrical circuitries on three-dimensional geometries4 Nov 2021US 2021/0345494 A1Dujud LLC
- Insulation systems and methods of depositing insulation systems5 Nov 2020US 2020/0347509 A1General Electric Company
- Electrophoretic deposition fluid, metal core substrate, and method for fabricating the metal core substrate12 Oct 2017US 2017/0292029 A1Mie University
- Embedded thin films12 Jan 2017US 2017/0013721 A9The Research Foundation for The State University of New York
- Method for Electrophoretically Depositing a Film on an Electronic Assembly18 Aug 2016US 2016/0240449 A1Infineon Technologies AG
Most cited
By later US patents
- Method for producing laminated film/metal structures for known good die ("KG") applications119US 5,776,824 AMicron Technology, Inc. · 1998
- Method of making multilayer circuit103US 5,590,460 ATessera, Inc. · 1997
- Method for manufacturing printed circuit boards96US 4,943,346 ASiemens Aktiengesellschaft · 1990
- Forming microelectronic connection components by electrophoretic deposition95US 6,492,201 B1Tessera, Inc. · 2002
- Method for fabricating metal core layers for a multi-layer circuit board74US 5,153,986 AInternational Business Machines Corporation · 1992