Insulation systems and methods of depositing insulation systems
AssigneeGeneral Electric Company
InventorsWeijun Yin, Anil Raj Duggal, Ravisekhar Nadimpalli Raju
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Abstract
This present disclosure generally relates to systems and methods of electrophoretic deposition (EPD) techniques for use in insulation systems at least partially encapsulating a semiconductor device, a conductive component and a substrate, such as insulation systems of semiconductor devices, busbars, or the like. Insulation systems formed using EPD processes may be designed to have a dielectric constant that decreases in a direction away from a substrate of the insulation system. This may improve insulation technologies since depositing coatings with sequentially arranged dielectric constants may improve resistance of the insulation system to high temperature, high electric fields, or the like.
Claims25
A semiconductor package, comprising:
- a semiconductor device disposed on a substrate;
- a conductive component interposed between the semiconductor device and the substrate;
- and
- an insulation system at least partially encapsulating the semiconductor device, the conductive component and the substrate, wherein the insulation system is characterized by a dielectric constant that decreases in a direction away from the substrate, and wherein the insulation system comprises at least one composite coating comprising a plurality of particles dispersed in a polymer matrix.
A method of packaging a semiconductor package comprising a semiconductor device disposed on a substrate and a conductive component interposed between the semiconductor device and the substrate, the method comprising:
- disposing an insulation system on at least a portion of a surface of the semiconductor device, the conductive component, and the substrate, via an electrophoretic process, wherein the insulation system is characterized by a dielectric constant that decreases in a direction away from the substrate, and wherein the insulation system comprises at least one composite coating comprising a plurality of particles dispersed in a polymeric matrix.
A busbar laminate, comprising:
- a plurality of conductive elements;
- a plurality of inner insulation coatings interspersed between the plurality of conductive elements to form a busbar stack;
- and
- an outer insulation coating at least partially encapsulating the busbar stack, wherein the outer insulation coating is characterized by a dielectric constant that is lower than the dielectric constant of the plurality of inner insulation coatings, and wherein the plurality of inner insulation coatings and the outer insulation coating comprise at least one composite coating comprising a plurality of particles dispersed in a polymer matrix.
A method of forming a busbar laminate, comprising:
- disposing a plurality of inner insulation coatings between a plurality of conductive elements to form a busbar stack;
- and
- at least partially encapsulating the busbar stack with an outer insulation coating, wherein the outer insulation coating is characterized by a dielectric constant that is lower than the dielectric constant of the plurality of inner insulation coatings, and wherein the plurality of inner insulation coatings and the outer insulation coating comprise at least one composite coating comprising a plurality of particles dispersed in a polymer matrix.
Dependencies are inferred from the claim text.