H05K 2203/1366
Spraying coating
H05K2203/1366 (Spraying coating) appears on 101 US grants and 105 published applications in this corpus.
Search patents in H05K- Granted patents
- 101
- Published applications
- 105
- Assignees
- 95
- Inventors
- 296
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 2 | 1 |
| 2004 | 0 | 2 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 6 |
| 2008 | 2 | 6 |
| 2009 | 1 | 3 |
| 2010 | 6 | 12 |
| 2011 | 2 | 3 |
| 2012 | 3 | 2 |
| 2013 | 3 | 6 |
| 2014 | 4 | 6 |
| 2015 | 2 | 3 |
| 2016 | 6 | 4 |
| 2017 | 7 | 5 |
| 2018 | 0 | 4 |
| 2019 | 2 | 6 |
| 2020 | 1 | 3 |
| 2021 | 6 | 9 |
| 2022 | 4 | 2 |
| 2023 | 4 | 4 |
| 2024 | 3 | 7 |
| 2025 | 2 | 5 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reusable composite stencil for spray processes14 Apr 2026US 12,600,159 B2Intel Corporation
- Barrier layer for an electrical device14 Apr 2026US 12,604,419 B2Honeywell International Inc.
- Protective coating composition for circuit board27 Jan 2026US 12,534,638 B2Samsung Electronics Co., Ltd.
- Electronic device and manufacturing method thereof21 Oct 2025US 12,451,440 B2FUJIFILM Corporation
- Hermetic coating of components29 Apr 2025US 12,289,840 B2Heraeus Medevio GmbH & Co. KG
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Heat dissipation substrate, heat dissipation circuit board, heat dissipation member, and method for manufacturing heat dissipation substrate5 Jun 2025US 2025/0185151 A1Kochi Prefectural Public University Corporation
- Method for printing an electrically conductive layer on a surface of 3d electronic assembly and associated 3d electronic assembly27 Feb 2025US 2025/0070043 A1Heraeus Electronics GmbH & Co. KG
- Drapable, flexible circuitry layers and methods therefor6 Feb 2025US 2025/0048559 A1LOOMIA Technologies, Inc.
Most cited
By later US patents
- System for performing work on workpieces89US 5,271,953 ADelco Electronics Corporation · 1993
- Spraying and dispensing apparatus80US 6,068,202 APrecision Valve & Automotion, Inc. · 2000
- Apparatus and methods for applying conformal coatings to electronic circuit boards58US 5,409,733 ANordson Corporation · 1995
- Conformal coating using multiple applications53US 6,132,809 APrecision Valve & Automation, Inc. · 2000
- Apparatus for applying a liquid coating with an improved spray nozzle45US 6,325,853 B1Nordson Corporation · 2001