Electronic device and manufacturing method thereof
AssigneeFUJIFILM Corporation
InventorYusuke Fujii
Life of this patent
Estimating the term…
Abstract
Provided are an electronic device including: a wiring board having a mounting surface; a plurality of electronic components mounted on the mounting surface; a ground electrode that surrounds at least one electronic component among the plurality of electronic components; an insulating protective layer that covers the at least one electronic component; an electromagnetic wave shielding layer that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer; and an insulating partition wall that is provided along an outer edge of the ground electrode, and a manufacturing method thereof.
Claims9
An electronic device comprising:
- a wiring board having a mounting surface;
- a plurality of electronic components mounted on the mounting surface of the wiring board;
- a ground electrode disposed to surround at least one electronic component among the plurality of electronic components in plan view;
- an insulating protective layer that is disposed in a ground region surrounded by the ground electrode and covers the at least one electronic component;
- an electromagnetic wave shielding layer that is provided to extend over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer;
- and
- an insulating partition wall that is provided along an outer edge of the ground electrode,
- wherein the insulating protective layer and the insulating partition wall are a solidified product of an ink for forming an insulating protective layer.
A manufacturing method of an electronic device, the method comprising:
- preparing an electronic substrate including a wiring board having a mounting surface, a plurality of electronic components mounted on the mounting surface of the wiring board, and a ground electrode disposed to surround at least one electronic component among the plurality of electronic components in plan view;
- forming an insulating protective layer that covers the at least one electronic component in a ground region surrounded by the ground electrode;
- and
- forming an electromagnetic wave shielding layer that extends over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, as a solidified product of an ink for forming an electromagnetic wave shielding layer,
- wherein an insulating partition wall is formed along an outer edge of the ground electrode before the forming an electromagnetic wave shielding layer, and
- in the forming an insulating protective layer, the insulating protective layer and the insulating partition wall are formed by using an ink for forming an insulating protective layer.
Dependencies are inferred from the claim text.