Method for printing an electrically conductive layer on a surface of 3d electronic assembly and associated 3d electronic assembly

Abstract

A method for depositing an electrically conductive layer on a surface of a three-dimensional (3D) electronic assembly comprising at least one electronic device embedded in a solid polymer material. The method comprises the steps of (i) providing a 3D electronic assembly, (ii) forming at least one flow barrier in the surface of the solid polymer material of the 3D electronic assembly, and (iii) depositing an electrically conductive layer on at least a portion of the surface of the solid polymer material, such that the electrically conductive layer is at least partially delimited by the flow barrier. The present invention also relates to an associated 3D electronic assembly.

Dependencies are inferred from the claim text.