H05K 2203/1338
Chemical vapour deposition
H05K2203/1338 (Chemical vapour deposition) appears on 80 US grants and 83 published applications in this corpus.
Search patents in H05K- Granted patents
- 80
- Published applications
- 83
- Assignees
- 64
- Inventors
- 208
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 6 | 1 |
| 2002 | 3 | 1 |
| 2003 | 2 | 1 |
| 2004 | 3 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 2 |
| 2012 | 2 | 0 |
| 2013 | 1 | 3 |
| 2014 | 0 | 7 |
| 2015 | 2 | 2 |
| 2016 | 1 | 5 |
| 2017 | 9 | 6 |
| 2018 | 5 | 6 |
| 2019 | 2 | 5 |
| 2020 | 4 | 5 |
| 2021 | 2 | 8 |
| 2022 | 5 | 5 |
| 2023 | 3 | 3 |
| 2024 | 4 | 5 |
| 2025 | 3 | 8 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Protective coating13 Jan 2026US 12,521,756 B2
- Electronic device21 Oct 2025US 12,453,016 B2Innolux Corporation
- Wiring board and method of producing wiring board24 Jun 2025US 12,342,473 B2Toppan Inc.
- Hermetic coating of components29 Apr 2025US 12,289,840 B2Heraeus Medevio GmbH & Co. KG
- Double-sided circuit non-oxide-based ceramic substrate and method for manufacturing same2 Jul 2024US 12,028,984 B2Hitachi Power Solutions Co., Ltd.
- Scalable, Printable, Patterned Sheet Of High Mobility Graphene On Flexible Substrates5 Feb 2026US 2026/0040445 A1
- Electronic device15 Jan 2026US 2026/0020163 A1Innolux Corporation
- Mainboard, method for forming immersed mainboard, and power supply module30 Oct 2025US 2025/0338386 A1Shanghai Metapwr Electronics Co., Ltd
- Chemical vapor deposition method of depositing iridium oxide on neural probe, provided on flexible printed circuit board, using ozone gas25 Sep 2025US 2025/0301577 A1UIF (University Industry Foundation), Yonsei University
- Substrate and manufacturing method thereof26 Jun 2025US 2025/0212321 A1
Most cited
By later US patents
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Structure having laser ablated features and method of fabricating154US 6,919,514 B2International Business Machines Corporation · 2005
- Forming via holes in a multilevel substrate in a single step139US 5,227,013 AMicroelectronics and Computer Technology Corporation · 1993
- Nanolaminated thin film circuitry materials79US 6,212,078 B1MicroCoating Technologies, Inc. · 2001
- Multilayer wiring board and manufacture method thereof79US 7,091,589 B2Dai Nippon Printing Co.Ltd. · 2006