Nanolaminated thin film circuitry materials
AssigneeMicroCoating Technologies, Inc.
InventorsAndrew T. Hunt, Wen-Yi Lin, Richard W. Carpenter
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Abstract
Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed patches of resistive material on opposite sides of the laminate act as capacitors. Electrical pathways horizontally through resistive material layers, which may be connected by via plated holes, act as resistors.
Claims42
A multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof, comprising at least two layers of resistive material and a dielectric material layer interposed between said two layers of resistive material, wherein said resistive material layers have a thickness of between about 10 and about 250 nanometers and said dielectric layers have a thickness of between about 10 and about 750 nanometers.
A multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof, comprising at least two layers of resistive material and a dielectric material layer interposed between said two layers of resistive material wherein said resistive material layers comprise platinum that is doped with dielectric material.
A multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof, comprising one layer of resistive material and one layer of dielectric material wherein said resistive material layer is a thin film less than a micron thick.
A multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof, comprising one layer of resistive material and one layer of dielectric material wherein said resistive material layer comprises platinum that is doped with a dielectric material.
Dependencies are inferred from the claim text.