Wiring board and method of producing wiring board
AssigneeToppan Inc.
InventorsTakeshi Tamura, Tetsuyuki Tsuchida
Life of this patent
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Abstract
A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.
Claims7
A wiring board, comprising:
- a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board having a first surface to which the first wiring board is bonded and a second surface to which semiconductor elements can be mounted,
- wherein an inorganic insulating film is formed between the second wiring layer and an insulating resin layer in the second wiring board, and
- wherein the second wiring board includes two or more insulating resin layers, an upper surface and a lower surface of one of the insulating resin layers being covered with respective inorganic insulating films.
A method of producing a wiring board comprising a first wiring board in which a first wiring layer is formed, and a second wiring board in which two or more second wiring layers finer than the first wiring layer are formed, the second wiring board having a first surface to which the first wiring board is bonded and a second surface to which semiconductor elements can be mounted, wherein the step of producing the second wiring board, comprising the steps of:
- forming a first insulating resin layer provided with a wiring pattern and openings corresponding to the second wiring layer;
- forming a first inorganic insulating film on the first insulating resin layer;
- forming a first conductor layer corresponding to the wiring pattern and the openings on the first inorganic insulating film;
- and
- forming a second inorganic insulating film on the first conductor layer, and
- forming the second insulating resin layer provided with a wiring pattern and openings on the second inorganic insulating film;
- forming openings in the second inorganic insulating film to align with the openings of the second insulating resin layer;
- and
- forming a second conductor layer electrically connected to the first conductor layer via the openings of the second inorganic insulating film.
Dependencies are inferred from the claim text.