H05K 2203/1355
Powder coating of insulating material
H05K2203/1355 (Powder coating of insulating material) appears on 33 US grants and 24 published applications in this corpus.
Search patents in H05K- Granted patents
- 33
- Published applications
- 24
- Assignees
- 26
- Inventors
- 102
- Latest grant
- 13 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 0 | 4 |
| 2008 | 0 | 1 |
| 2009 | 3 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 1 |
| 2012 | 1 | 2 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 2 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 4 |
| 2018 | 2 | 2 |
| 2019 | 3 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 2 |
| 2022 | 2 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board13 Sep 2022US 11,445,605 B2TDK Corporation
- Methods and processes for forming electrical circuitries on three-dimensional geometries12 Apr 2022US 11,304,303 B2Dujud LLC
- Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate11 May 2021US 11,001,042 B2Murata Manufacturing Co., Ltd.
- Light source module, fabrication method therefor, and lighting device including the same3 Sep 2019US 10,401,015 B2LG Electronics Inc.
- Light source module11 Jun 2019US 10,317,068 B2LG Electronics Inc.
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Methods and processes for forming electrical circuitries on three-dimensional geometries4 Nov 2021US 2021/0345494 A1Dujud LLC
- Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board14 Jan 2021US 2021/0014966 A1TDK Corporation
- Electrically isolated assembly and method for the electrical isolation of an assembly26 Jul 2018US 2018/0213652 A1Vacuumschmelze GmbH & Co.KG
- Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate5 Jul 2018US 2018/0186138 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Printed circuit board61US 4,221,925 AWestern Electric Company, Inc. · 1980
- Method of fabricating metal printed wiring boards44US 3,934,334 ATexas Instruments Incorporated · 1976
- Multilayer circuit board with fluoropolymer interlayers30US 4,824,511 AE. I. Du Pont de Nemours and Company · 1989
- Printed wiring board29US 4,303,715 AWestern Electric Company, Inc. · 1981
- Baseboard for printed circuit board and method of producing the same25US 4,188,415 AHitachi Chemical Company, Ltd. · 1980