Baseboard for printed circuit board and method of producing the same

A method of producing a baseboard for a printed circuit board comprising applying onto the surface of a metal substrate a resin coating, characterized in that the application of a resin coating is effected by dipping a metal substrate having through-holes in a solution of a resin in a solvent which solution has a resin concentration of not more than 50% by weight and a viscosity of not more than 50 centipoises and taking the metal substrate out of said solution in a direction of at an angle of 90.degree..+-.30.degree. with respect to the axis of the through-holes of said metal substrate at a velocity of not more than 1,000 mm/min to form a resin coat layer covering the overall surface of the metal substrate and filling the through-holes which, upon drying, forms a membrane over said holes which breaks and results in the formation of a coating on the inner wall surfaces of the through-holes and in the formation, at the circumferential edges formed by the intersection of the upper and lower surfaces of said metal substrate with the inner walls of said through-holes, of a coating having a thickness larger than the thickness of said coating on said upper and said lower surface of the metal substrate.