Multilayer circuit board with fluoropolymer interlayers
AssigneeE. I. Du Pont de Nemours and Company
InventorsFrederick N. Hartman, Alan C. Knight
Life of this patent
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Abstract
A multilayer circuit board consisting of multiple circuit layers supported on sheets of PTFE or PTFE containing a fibrous stiffening agent, said circuit-bearing sheets being joined in fixed relative positions by means of separating layers of a adhesive unsintered tetrafluoroethylene resin.
Claims1
A process of assembling circuit-bearing sheets containing surface portions of conductive circuitry and surface portions of polytetrafluoroethylene to form multilayer laminates in which unsintered tetrafluoroethylene polymer made by dispersion polymerization is inserted between the sheets, pressure is applied at 50-1000 psi at a temperature below the fusion temperature of the polymer to encapsulate the circuits, and, in a separate step at a lower pressure of 0-50 psi the assembly is heated above the fusion temperature of the polymer to fuse the polymer particles into a continuous mass.
Dependencies are inferred from the claim text.