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US 11,445,605 B2Granted
Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board
AssigneeTDK Corporation
InventorsTakaaki Morita, Seiko Komatsu, Seiichi Tajima, Wakiko Sato
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Abstract
A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.
Claims13
A printed wiring board comprising a base member of a liquid crystal polymer having wiring formed on at least one surface, wherein
- the printed wiring board comprising an insulating layer including the liquid crystal polymer and a conductor portion including a wiring layer having a predetermined pattern line width, wherein
- the molecular orientation of the liquid crystal polymer is random in the insulating layer, and wherein
- a degree of crystal orientation of the liquid crystal polymer is 0.3 or less in a plane direction of the insulating layer,
- wherein the degree of crystal orientation is calculated from the following equation from a two-dimensional diffraction image obtained by a wide-angle X-ray diffraction method:
- degree of crystal orientation=(maximum peak area−minimum peak area)/maximum peak area,
- wherein the maximum peak area is an integrated value of a peak intensity at the maximum intensity peak, and the minimum peak area is an integrated value of a peak intensity at the minimum intensity peak.
3 more elements
Dependencies are inferred from the claim text.