Precision spray processes for direct write electronic components
AssigneeOptomec Design Company
InventorsW. Doyle Miller, David M. Keicher, Marcelino Essien
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Abstract
This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.
Claims38
A method for direct material deposition on a substrate, said method comprising:
- (a) passing one or more finely divided feedstocks through an intersection region of a plurality of laser beams under conditions sufficient to convert substantially all of said feedstock into a depositable form, and
- (b) depositing said depositable feedstock on said substrate,
- wherein said finely divided feedstock comprises feedstock particles of less than about 40 μm in diameter.
A method for direct material deposition on a substrate, said method comprising:
- (a) passing one or more feedstocks from a feedstock source through one or more laser beams under conditions sufficient to both convert substantially all of said feedstock into a depositable form, and to guide said feedstock through one or more hollow fibers disposed between said feedstock source and said substrate, and
- (b) depositing said depositable feedstock on said substrate.
A method for direct material deposition on a substrate, said method comprising:
- (a) passing one or more feedstocks through an intersection region of a plurality of laser beams under conditions sufficient to convert substantially all of said feedstock into a depositable form,
- (b) focusing said depositable feedstock by employing guided laser deposition means, and
- (c) depositing said depositable feedstock on said substrate.
Dependencies are inferred from the claim text.