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US 2026/0190241 A1Published application
Method for forming blind vias and method for manufacturing packaging substrate
AssigneeAbsolics Inc.
InventorsChun Jae LEE, DAE HWAN KIM
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Abstract
According to the embodiments, a method for forming blind vias and a method for manufacturing a packaging substrate comprise: a protective-layer arranging operation of preparing a substrate in which a machining protective layer is disposed over an insulating layer; a laser operation of forming a blind via at a predetermined position on the machining protective layer; and a cleaning operation of removing particulate by-products or smear generated in the blind via and removing the machining protective layer, thereby forming a blind via in the insulator.
Claims10
A method for forming blind vias in an insulator, comprising:
- a protective-layer arranging operation of preparing a substrate in which a machining protective layer is disposed over an insulating layer;
- a laser operation of forming a blind via at a predetermined position on the machining protective layer;
- and
- a cleaning operation of removing particulate by-products or smear generated in the blind via and removing the machining protective layer.
1 more element
Dependencies are inferred from the claim text.