H05K 2203/1383
Temporary protective insulating layer
H05K2203/1383 (Temporary protective insulating layer) appears on 122 US grants and 118 published applications in this corpus.
Search patents in H05K- Granted patents
- 122
- Published applications
- 118
- Assignees
- 94
- Inventors
- 328
- Latest grant
- 19 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 7 |
| 2003 | 0 | 2 |
| 2004 | 5 | 4 |
| 2005 | 4 | 2 |
| 2006 | 2 | 7 |
| 2007 | 2 | 4 |
| 2008 | 1 | 1 |
| 2009 | 3 | 9 |
| 2010 | 1 | 7 |
| 2011 | 4 | 4 |
| 2012 | 4 | 7 |
| 2013 | 3 | 5 |
| 2014 | 5 | 5 |
| 2015 | 6 | 8 |
| 2016 | 1 | 7 |
| 2017 | 8 | 3 |
| 2018 | 6 | 5 |
| 2019 | 3 | 5 |
| 2020 | 4 | 5 |
| 2021 | 4 | 5 |
| 2022 | 5 | 2 |
| 2023 | 2 | 1 |
| 2024 | 2 | 7 |
| 2025 | 0 | 4 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing shielded printed wiring board and shielded printed wiring board19 Nov 2024US 12,150,239 B2Tatsuta Electric Wire & Cable Co., Ltd.
- Pressure-sensitive adhesive sheet-including wiring circuit board and producing method thereof12 Nov 2024US 12,144,125 B2Nitto Denko Corporation
- Coatings and processing of transparent conductive films for stabilization of sparse metal conductive layers12 Dec 2023US 11,842,828 B2C3 Nano, Inc.
- Method of making interconnect substrate and insulating sheet21 Mar 2023US 11,612,063 B2Shinko Electric Industries Co., Ltd.
- Wiring circuit board assembly sheet and producing method thereof15 Nov 2022US 11,503,716 B2Nitto Denko Corporation
- Method for forming blind vias and method for manufacturing packaging substrate2 Jul 2026US 2026/0190241 A1Absolics Inc.
- System and process for manufacturing flexible circuit board by laser cutting28 May 2026US 2026/0150198 A1Huaian M & T New Material Technology Co., Ltd
- Pattern formation method and pattern formation structure6 Nov 2025US 2025/0344324 A1Resonac Corporation
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Masking method and masked product24 Apr 2025US 2025/0133661 A1P2i Ltd.
Most cited
By later US patents
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Thin substrate micro-via interconnect167US 5,493,096 AGrumman Aerospace Corporation · 1996
- Semiconductor flip chip package145US 6,018,196 AW. L. Gore & Associates, Inc. · 2000
- Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias130US 6,103,992 AW. L. Gore & Associates, Inc. · 2000
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001