Thin substrate micro-via interconnect
AssigneeGrumman Aerospace Corporation
InventorWei H. Koh
Life of this patent
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Abstract
A method for forming conductive via interconnects utilizes the steps of: applying a sacrificial coating to at least one surface of a substrate; laser drilling the substrate through the sacrificial coating to form a via through-hole; applying a conductive coating to the via through-hole; and removing the sacrificial coating(s). Recasting and shattering thus occur in the sacrificial coating rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Claims69
A method for forming a conductive via interconnect, the method comprising the steps of:
- a) applying a sacrificial coating, of a high melting temperature polymer, to at least one surface of a substrate;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- c) applying a conductive coating to the via through-hole;
- and
- d) removing the at least one sacrificial coating(s);
- e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
A method for forming a via through-hole, the method comprising the steps of:
- a) applying a sacrificial coating formed as a polymer to at least one surface of a substrate;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- and
- c) removing the at least one sacrificial coating(s);
- d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
A method for forming a conductive via interconnect, the method comprising the steps of:
- a) applying a sacrificial coating to at least one surface of a substrate having a thickness of greater than approximately 100 microns;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- c) applying a conductive coating to the via through-hole;
- and
- d) removing the at least one sacrificial coating(s);
- e) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
A method for forming a conductive via interconnect, the method comprising the steps of:
- a) applying an organic sacrificial coating to at least one surface of a substrate;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- c) applying a conductive coating to the via through-hole;
- d) sintering the conductive coating applied to the via through-hole at a temperature above the decomposition point of the sacrificial coating so as to cause the sacrificial coating to decompose;
- and
- e) removing the at least one sacrificial coating(s);
- f) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
A method for forming a via through-hole, the method comprising the steps of:
- a) applying a sacrificial coating formed as a polymide to at least one surface of a substrate;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- and
- c) removing the at least one sacrificial coating(s);
- d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
A method for forming a via through-hole, the method comprising the steps of:
- a) applying a sacrificial coating to at least one surface of a substrate having a thickness of approximately greater than 100 microns;
- b) laser drilling the substrate through the sacrificial coating to form a via through-hole;
- and
- c) removing the at least one sacrificial coating(s);
- d) wherein recasting and shattering occur in the sacrificial coating(s) rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
Dependencies are inferred from the claim text.