Pressure-sensitive adhesive sheet-including wiring circuit board and producing method thereof

A pressure-sensitive adhesive sheet-including wiring circuit board comprising:

• the wiring circuit board including:
• a base insulating layer,
• a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and
• a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer;
• a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board;
• and
• a reinforcement substrate surrounding an entire periphery of the wiring circuit board at intervals thereto in a plane direction perpendicular to the thickness direction of the wiring circuit board,
• wherein the pressure-sensitive adhesive sheet includes the wiring circuit board and the reinforcement substrate when projected in the thickness direction, and is continuous in the plane direction, and is disposed on the surface of the same side as the surface of the wiring circuit board in the reinforcement substrate, and
• wherein a width of an isolation region that is a distance between an outer peripheral surface of the wiring circuit board and an inner peripheral surface of the reinforcement substrate is 10 μm or more and 2000 μm or less.