Method of making interconnect substrate and insulating sheet
AssigneeShinko Electric Industries Co., Ltd.
InventorTomoaki Machida
Life of this patent
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Abstract
An insulating sheet for use in forming an insulating layer of an interconnect substrate includes a semi-cured insulating resin layer, a semi-cured protective resin layer laminated on an upper surface of the insulating resin layer, and a cover layer laminated on an upper surface of the protective resin layer, wherein the protective resin layer has lower resistance to a predetermined solution than the insulating resin layer has, the predetermined solution being capable of dissolving the insulating resin layer and/or the protective resin layer.
Claims4
An insulating sheet for use in forming an insulating layer of an interconnect substrate, comprising:
- a semi-cured insulating resin layer;
- a semi-cured protective resin layer laminated on an upper surface of the insulating resin layer;
- and
- a removable cover layer laminated on an upper surface of the protective resin layer,
- wherein a material of the insulating resin layer after being fully cured has first resistance against a predetermined solution, and a material of the protective resin layer after being fully cured has second resistance against the predetermined solution, the second resistance being lower than the first resistance, the predetermined solution being for dissolving remnants of the insulating resin layer and the protective resin layer when the remnants are generated by making a via hole through the insulating resin layer and the protective resin layer after the insulating resin layer and the protective resin layer are fully cured.
Dependencies are inferred from the claim text.