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US 12,507,348 B2Granted
Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJesang Park, Changgun Oh, Yangje Lee, Hyun Kyung Park
Life of this patent
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Abstract
A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.
Claims9
A circuit board comprising:
- a first insulation layer;
- a first circuit wire that is disposed on the first insulation layer;
- a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer;
- and
- a third insulation layer that is disposed on the second insulation layer and includes a cavity,
- wherein a bottom surface of the cavity is a portion of a top surface of the second insulation layer,
- the cavity comprises:
- a first cavity portion that is adjacent to the second insulation layer;
- and
- a second cavity portion that communicates with the first cavity portion and is disposed on the first cavity portion, and
- a width of the first cavity portion is wider than a width of the second cavity portion.
8 more elements
Dependencies are inferred from the claim text.