H05K 2203/1388
Temporary protective conductive layer
H05K2203/1388 (Temporary protective conductive layer) appears on 21 US grants and 24 published applications in this corpus.
Search patents in H05K- Granted patents
- 21
- Published applications
- 24
- Assignees
- 21
- Inventors
- 70
- Latest grant
- 5 Jul 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 4 |
| 2003 | 0 | 0 |
| 2004 | 2 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 3 |
| 2011 | 0 | 3 |
| 2012 | 3 | 2 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 2 | 2 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board5 Jul 2022US 11,382,213 B2Samsung Electro-Mechanics Co., Ltd.
- Flexible circuit board and display device21 Dec 2021US 11,204,659 B2Wuhan Tianma Micro-Electronics Co., Ltd.
- Laminate including conductive circuit patterns19 Feb 2019US 10,212,815 B2Tecnomar Oy
- Embedded printed circuit board18 Apr 2017US 9,629,248 B2LG Innotek Co., Ltd.
- Method of etching metal layer6 Oct 2015US 9,150,969 B2Tokyo Electron Limited
- Method for forming blind vias and method for manufacturing packaging substrate2 Jul 2026US 2026/0190241 A1Absolics Inc.
- Method for fabricating a circuit board arrangement, circuit board pre-assembly and implantable medical device comprising a circuit board arrangement26 Mar 2026US 2026/0089901 A1Biotronik SE & Co.KG
- Method for manufacturing multilayer substrate27 Nov 2025US 2025/0365869 A1Fict Limited
- Printed circuit board5 May 2022US 2022/0141953 A1Samsung Electro-Mechanics Co., Ltd.
- Flexible circuit board and display device6 May 2021US 2021/0132718 A1Wuhan Tianma Micro-Electronics Co., Ltd.
Most cited
By later US patents
- Process for manufacturing base material for printed circuits23US 3,948,701 AAEG-Isolier-und Kunststoff GmbH · 1976
- Method for the production of through holes in a laminate21US 4,023,998 APerstorp AB · 1977
- Method of external circuitization of a circuit panel14US 5,158,645 AInternational Business Machines Corporation · 1992
- Printed circuit manufacture13US 5,609,746 AInternational Computers Limited · 1997
- Method of forming via holes in a insulation film and method of cutting the insulation film13US 5,628,926 ANEC Corporation · 1997