Method of forming via holes in a insulation film and method of cutting the insulation film
AssigneeNEC Corporation
InventorsHaba Belgacem, Yukio Morishige
Life of this patent
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Abstract
A method of forming via holes in an organic insulation film or cutting the film includes the steps of exposing predetermined parts of the film to a laser beam to raise a temperature of the exposed parts of the film until the exposed parts are transformed or decomposed and subjecting the film to an ultra sonic wave so that the transformed or decomposed parts are dispersed.
Claims38
A method of forming via holes in an organic insulation film comprising the steps of:
- exposing predetermined parts of said film to a laser beam to raise a temperature of said exposed parts of said film until said exposed parts are transformed or decomposed;
- subjecting said film to an ultra sonic wave so that said transformed or decomposed parts are dispersed to form via holes.;
- and
- forming a layer having a high absorptivity to a laser beam by subjecting said film to a liquid including sodium naphthalene.
A method of cutting an organic insulation film comprising the steps of:
- exposing predetermined parts of said film to a laser beam to raise a temperature of said exposed parts of said film until said exposed parts are transformed or decomposed;
- subjecting said film to an ultra sonic wave so that said transformed or decomposed parts are dispersed to cut said film;
- and
- forming a layer having a high absorptivity to a laser beam by subjecting said film to a liquid including sodium naphthalene.
A method of forming via holes in an organic insulation film comprising the steps of:
- exposing predetermined parts of said film to a laser beam to raise a temperature of said exposed parts of said film until said exposed parts are transformed or decomposed, said film being formed of a base material--filler material pair, said pair being selected from the group consisting of:
- a base material of synthetic resin polymer and a filler material of glass particles, a base material of an epoxy resin and a filler material of insulation compound particles, a base material of a polyamide resin and a filler material of insulation compound particles and a base material of synthetic resin polymer and a filler material of insulation compound particles;
- and
- subjecting said film to an ultrasonic wave so that said transformed or decomposed parts are dispersed to form via holes.
A method of cutting an organic insulation film comprising the steps of:
- exposing predetermined parts of said film to a laser beam to raise a temperature of said exposed parts of said film until said exposed parts are transformed or decomposed, said film being formed of a base material--filler material pair, said pair selected from the group consisting of:
- a base material of synthetic resin polymer and a filler material of glass particles, a base material of an epoxy resin and a filler material of insulation compound particles, a base material of a polyamide resin and a filler material of insulation compound particles, and a base material of synthetic resin polymer and a filler material of insulation compound particles;
- and
- subjecting said film to an ultrasonic wave so that said transformed or decomposed parts are dispersed to cut said film.
Dependencies are inferred from the claim text.