Printed circuit board

A printed circuit board comprising:

• a first insulating layer;
• a second insulating layer disposed on an upper surface of the first insulating layer;
• a first cavity penetrating through a portion of the second insulating layer and having a portion of an upper surface of the second insulating layer as a bottom surface of the first cavity;
• a second cavity penetrating through the second insulating layer and a portion of the first insulating layer and having a portion of the upper surface of the first insulating layer as a bottom surface of the second cavity;
• a first wiring layer buried in a lower portion of the first insulating layer and at least partially exposed from the first insulating layer by the second cavity;
• and
• a second wiring layer buried in a lower portion of the second insulating layer and at least partially exposed from the second insulating layer by the first cavity,
• wherein the second cavity is deeper than the first cavity.

A printed circuit board comprising:

• a first insulating layer;
• a first wiring layer at least partially buried in the first insulating layer;
• a second insulating layer disposed on an upper surface of the first insulating layer;
• a second wiring layer at least partially buried in the second insulating layer;
• a via disposed in the first insulating layer and connecting the first wiring layer and the second wiring layer to each other;
• and
• a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity,
• wherein the first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity,
• an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity,
• a width of the via increases in a direction from the first wiring layer to the second wiring layer, and
• the wiring pattern extends continuously from a lower surface of the wiring pattern to the upper surface of the wiring pattern.