Method of external circuitization of a circuit panel
AssigneeInternational Business Machines Corporation
InventorsKathleen L. Covert, Charles C. Emmons, Elizabeth Foster, Richard W. Malek, Voya R. Markovich, Stephen L. Tisdale, Charyl L. Tytran
Life of this patent
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Abstract
A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.
Claims38
In a method of fabricating a printed circuit panel, which method comprises applying a protective layer to a surface of the panel to protect the surface morphology of the panel for further processing, drilling a through hole in the panel, cleaning the through hole to remove drilling debris therefrom, and circuitizing the surface of the panel and the through hole, the improvement comprising:
- a. applying a strippable thin film of Cu to the surface of the printed circuit panel;
- b. drilling the through hole through the strippable thin film of Cu and the printed circuit panel;
- c. thereafter etching the strippable thin film of Cu to uncover the surface morphology;
- and
- d. circuitizing the surface of the printed circuit panel.
A method of fabricating a printed circuit panel, which method comprises:
- a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing;
- b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel;
- c. cleaning the through hole to remove drilling debris therefrom;
- d. etching the strippable thin film of Cu to uncover the surface morphology;
- and
- e. thereafter circuitizing the surface of the panel and the through hole.
A method of fabricating a printed circuit panel, which method comprises:
- a. applying a strippable thin film of Cu to the surface of the printed circuit panel to protect the surface morphology of the panel for further processing;
- b. drilling a through hole through the strippable thin film of Cu and the printed circuit panel;
- c. cleaning the through hole to remove drilling debris therefrom;
- d. circuitizing the surface of the panel and the through hole;
- and
- e. thereafter etching the strippable thin film of Cu to uncover the surface morphology.
Dependencies are inferred from the claim text.