Laminate including conductive circuit patterns
AssigneeTecnomar Oy
InventorTom Marttila
Life of this patent
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Abstract
A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.
Claims3
A laminate, containing conductive circuit patterns, a substrate material, and a first adhesive pattern or other bond, or a part of laminate, wherein
- i) each conductive circuit pattern and the substrate material are interconnected by the first adhesive pattern or other bond, having its size and shape matching the main outlines of each conductive circuit pattern, an edge of the first adhesive pattern or other bond being not more distant from an edge of each conductive circuit pattern than twice a diameter of a laser beam used for patterning the main outlines of each conductive circuit pattern,
- ii) each conductive circuit pattern has at least one area, gap, or interline space, wherein, on top of the first adhesive pattern or other bond, conductive material in direct contact with the first adhesive pattern or other bond has been removed by a laser beam, such that the first adhesive pattern or other bond still extends at least to an edge of the remaining conductive material and the at least one area, gap, or interline space may have residues of the first adhesive pattern or other bond, and
- iii) outside the conductive circuit patterns' main outlines, there are areas where the substrate material is void of the first adhesive pattern or other bond.
Dependencies are inferred from the claim text.