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US 9,629,248 B2Granted
Embedded printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorsDeok Soon Kwon, Sang Hyuck Nam, Won Suk Jung
Life of this patent
Estimating the term…
Abstract
Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.
Claims19
An embedded printed circuit board, comprising:
- a first insulating substrate including a first cavity in which a first element is mounted;
- a second cavity separated from the first cavity and formed to pass through the first insulating substrate;
- an adhesive layer disposed on the first insulating substrate to cover a part of the first cavity and a part of an upper portion of the first element;
- and
- a second insulating substrate formed on a bottom surface of the second cavity.
2 more elements
Dependencies are inferred from the claim text.