Structure Utilizing a PCB as an Interconnecting Carrier for Heating Elements

A structure utilizing a PCB as an interconnecting carrier for heating elements, characterized by:

• An upper layer of hot melt adhesive film;
• A lower layer of hot melt adhesive film;
• A rigid PCB positioned between the upper and lower layers of hot melt adhesive film. The rigid PCB includes solder pads for connecting a power supply, a temperature controller, and at least one heating element, and the solder pads are connected to the corresponding electronic wiring harnesses through soldering.
• The upper and lower layers of hot melt adhesive film are bonded through a heating process, forming an encapsulated structure that covers the rigid PCB and its solder pads. The encapsulated structure leverages the rigidity and non-deformable nature of the rigid PCB to create a primary waterproof area that remains stable and unchanged.
• Additionally, the surface area of the upper and lower layers of hot melt adhesive film is larger than that of the rigid PCB. This design ensures that after the films are melted and bonded, the rigid PCB is enclosed within them, creating a secondary, flexible, and adaptive waterproof buffer area around the primary, rigid waterproof area.