H05K 2203/1394
Covering open pths
Official title: Covering open PTHs, e.g. by dry film resist or by metal disc
H05K2203/1394 (Covering open pths) appears on 163 US grants and 107 published applications in this corpus.
Search patents in H05K- Granted patents
- 163
- Published applications
- 107
- Assignees
- 101
- Inventors
- 369
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 15 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 6 |
| 2002 | 7 | 6 |
| 2003 | 3 | 11 |
| 2004 | 8 | 9 |
| 2005 | 6 | 9 |
| 2006 | 4 | 6 |
| 2007 | 6 | 12 |
| 2008 | 5 | 11 |
| 2009 | 5 | 8 |
| 2010 | 9 | 3 |
| 2011 | 0 | 2 |
| 2012 | 4 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 1 |
| 2015 | 2 | 5 |
| 2016 | 3 | 2 |
| 2017 | 2 | 3 |
| 2018 | 2 | 1 |
| 2019 | 1 | 0 |
| 2020 | 2 | 3 |
| 2021 | 2 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 3 |
| 2024 | 1 | 2 |
| 2025 | 1 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Circuit substrate and method for manufacturing the same14 Oct 2025US 12,446,153 B2KYOCERA Corporation
- Printed circuit board4 Jun 2024US 12,004,287 B2Telefonaktiebolaget LM Ericsson (publ)
- Component carrier with a solid body protecting a component carrier hole from foreign material ingression21 Mar 2023US 11,612,064 B2AT&SAustria Technologie & Systemtechnik AG
- Selective removal of adhesive from coverlay for printed circuit board insulation10 Jul 2025US 2025/0227837 A1Rockwell Collins, Inc.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module1 Aug 2024US 2024/0260168 A1Vitesco Technologies GmbH
- Method for Manufacturing a Sheet with Double-Sided Structured Conducting Layers for Electronic Applications25 Jan 2024US 2024/0032207 A1
- Circuit substrate and method for manufacturing the same21 Sep 2023US 2023/0300983 A1KYOCERA Corporation
- Shielded signal vias in printed circuit boards for high-frequency and broadband signals14 Sep 2023US 2023/0292431 A1TTM Technologies, Inc.
Most cited
By later US patents
- Multi-layer PCB blockade-via pad-connection116US 5,764,485 A1998
- Electronic part including a thin body of molding resin107US 5,729,437 ASeiko Epson Corporation · 1998
- Printed circuit board with aligned connections and method of making same98US 5,450,290 AInternational Business Machines Corporation · 1995
- Electronic component utilizing face-down mounting64US 6,351,194 B2Oki Electric Industry Co., Ltd. · 2002
- Process for producing a printed wiring board61US 5,252,195 AMitsubishi Rayon Co., Ltd. · 1993