Electronic component utilizing face-down mounting

An electronic device comprising:

• a multi-layered printed circuit board made of an organic material,
• a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board, said plurality of electronic components including a duplexer having a transmitting surface acoustic wave filter and a receiving surface acoustic wave filter, and
• a metal cover for covering said plurality of electronic components while maintaining a space or a cavity between a bottom surface of said electronic components and an inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to a surface of said multi-layered printed circuit board, wherein:
• almost an entire surface of a top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover, is covered by a metal layer, and said receiving surface acoustic wave filter has an unobstructed space between a bottom of said receiving surface acoustic wave filter and said metal cover, and
• said multi-layered printed circuit board includes at least one through-hole orthogonally penetrating said multi-layer printed circuit board at a location corresponding to said flange, with said through-hole lined by a metal film.

An electronic device comprising:

• a multi-layered printed circuit board made of an organic material,
• a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board, said plurality of electronic components including a duplexer having a transmitting surface acoustic wave filter and a receiving surface acoustic wave filter,
• a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board, and
• a heat conductive member packed between said bottom surface of at least one of said plurality of electronic components and the inner surface of said metal cover, wherein:
• said multi-layered printed circuit board has at least one through-hole vertically penetrating said multi-layered printed circuit board at a location corresponding to said flange and is lined by a metal film,
• said multi-layered printed circuit board has a heat conductive layer made of a metal and which is arranged along the rear surface of said multi-layered printed circuit board, said heat conductive layer being connected to a metal lining of said through-hole, and
• said multi-layered printed circuit board has a metal layer covering almost an entire surface of the top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) at least two electronic components mounted in a face-down position on said multi-layered printed circuit board, one component being for transmission functions in electromagnetic communication of information, and one component being for receiving functions in electromagnetic communication of information;
• (c) a metal cover connected to the multi-layered printed circuit board covering the at least two electronic components and forming an enclosed space between the cover and the circuit board, with the electronic components therein;
• and
• (d) a heat conduction member disposed in the enclosed space and connected to the cover so as to conduct heat to the cover, and to the component operable for transmission functions in electromagnetic communication of information, the other component being devoid of a connection to the heat conduction member.

An electronic device comprising:

• a multi-layered printed circuit board made of an organic material,
• a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board, said plurality of electronic components including a duplexer having a transmitting surface acoustic wave filter and a receiving surface acoustic wave filter, and
• a metal cover for covering said plurality of electronic components while maintaining a space or a cavity between a bottom surface of said electronic components and an inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to a surface of said multi-layered printed circuit board, wherein:
• almost an entire surface of a top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover, is covered by a metal layer, and said receiving surface acoustic wave filter has an unobstructed space between a bottom of said receiving surface acoustic wave filter and said metal cover, and
• said multi-layered printed circuit board has at least one blind through-hole at locations facing said space or said cavity covered by said metal cover.

An electronic device comprising:

• a multi-layered printed circuit board comprising a plurality of organic layers, each of which is intervened by wirings and/or at least one impedance matching circuit having a strip line structure,
• a wiring region arranged on a limited area of the top surface of said multi-layered printed circuit board,
• a first surface acoustic wave filter and a second surface acoustic wave filter attached in a face-down position to said wiring region,
• a plurality of external connection terminals arranged on the rear surface of said multi-layered printed circuit board, said plurality of external terminals being used for connecting said couple of surface acoustic wave filters,
• a couple of conductive layers arranged on the remaining areas of the top and rear surfaces of said multi-layered printed circuit board,
• a common terminal selected from said plurality of external connection terminals,
• a first line for connecting said first surface acoustic wave filter and a diverging point at which a line from said common terminal is diverged to said first surface acoustic wave filter,
• a second line diverged at said diverging point from said common terminal and for connecting said second acoustic wave filter and said common terminal, said connection being conducted through said second line and said impedance matching circuit, wherein:
• said first line is composed of a blind through hole of which the lower end is immediately connected to said diverging point, and further comprising:
• at least one bonding terminal arranged for connecting said transmitting one of said surface acoustic wave filters and the upper end of said blind through hole at a location immediately above said blind through hole or in the neighborhood of said blind through hole, and each of said bonding terminals is connected to a terminal to be connected to said common terminal of said transmitting surface acoustic wave filter.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the top surface of said multi-layered printed circuit board;
• and
• (d) a heat conductive member packed between said bottom surface of at least one of said plurality of electronic components and the inner surface of said metal cover, wherein said multi-layered printed circuit board has at least one through-hole vertically penetrating said multi-layered printed circuit board at a location corresponding to said flange and being lined by a metal film, and said multi-layered printed circuit board has a heat conductive layer made of a metal and which is arranged along the rear surface of said multi-layered printed circuit board, said heat conductive layer being connected to said metal film lining said through-hole, and said multi-layered printed circuit board has at least one blind through-hole at locations facing said space or said cavity covered by said metal cover.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• and
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board, wherein almost an entire surface of the top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover, is covered by a metal layer, and said multi-layered printed circuit board has at least one blind through-hole at locations facing said space or said cavity covered by said metal cover.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board;
• and
• (d) a heat conductive member packed between said bottom surface of at least one of said plurality of electronic components and the inner surface of said metal cover, wherein said multi-layered printed circuit board has at least one through-hole vertically penetrating said multi-layered printed circuit board at a location corresponding to said flange and is lined by a metal film, said multi-layered printed circuit board has a heat conductive layer made of a metal and which is arranged along the rear surface of said multi-layered printed circuit board, said heat conductive layer being connected to a metal lining of said through-hole, said multi-layered printed circuit board has a metal layer covering almost an entire surface of the top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover, and said multi-layered printed circuit board has at least one blind through-hole at locations facing said space or said cavity covered by said metal cover.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board;
• and
• (d) a heat conductive member packed between said bottom surface of at least one of said plurality of electronic components and the inner surface of said metal cover, wherein said multi-layered printed circuit board has at least one through-hole vertically penetrating said multi-layered printed circuit board at a location corresponding to said flange and is lined by a metal film, and said multi-layered printed circuit board has a heat conductive layer made of a metal and which is arranged along the rear surface of said multi-layered printed circuit board, said heat conductive layer being connected to said metal lining of said through-hole, and at least two of said plurality of electronic components emit an electromagnetic wave, and said heat conductive member is a metal foil bridging the bottom surface of one of said electronic components which generates a larger volume of heat and a location of the inner surface of said metal cover, said location corresponding to the other one of said electronic components which generates a smaller volume of heat, and said one of said electronic components and said other one of said electronic components are electromagnetically shielded by the metal foil having a U-shaped intermediation of which one end is contacted with one of the edges of the bottom surface of said one of said electronic components and of which the other end is adhered to the inner surface of said metal cover at a location corresponding to the bottom surface of said other one of said electronic components.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board;
• and
• (d) a heat conductive member packed between said bottom surface of at least one of said plurality of electronic components and the inner surface of said metal cover, wherein said multi-layered printed circuit board has at least one through-hole vertically penetrating said multi-layered printed circuit board at a location corresponding to said flange and is lined by a metal film, said multi-layered printed circuit board has a heat conductive layer made of a metal and which is arranged along the rear surface of said multi-layered printed circuit board, said heat conductive layer being connected to a metal lining of said through-hole, said multi-layered printed circuit board has a metal layer covering almost an entire surface of the top surface of said multi-layered printed circuit board, which top surface faces said space or said cavity covered by said metal cover, and at least two of said plurality of electronic components emit an electromagnetic wave, and said heat conductive member is a metal foil bridging the bottom surface of one of said electronic components which generates a larger volume of heat and a location of the inner surface of said metal cover, said location corresponding to the other one of said electronic components which generates a smaller volume of heat, and said one of said electronic components and said other one of said electronic components are electromagnetically shielded by the metal foil having a U-shaped intermediation of which one end is contacted with one of the edges of the bottom surface of said one of said electronic components and of which the other end is adhered to the inner surface of said metal cover at a location corresponding to the bottom surface of said other one of said electronic components.

An electronic device comprising:

• (a) a multi-layered printed circuit board made of an organic material;
• (b) a plurality of electronic components mounted in a face-down position on said multi-layered printed circuit board;
• (c) a metal cover for covering said plurality of electronic components remaining a space or a cavity between the bottom surface of said electronic components and the inner surface of said metal cover, said metal cover having a flange surrounding the outskirts of said metal cover to be adhered to the surface of said multi-layered printed circuit board, and said multi-layered printed circuit board has at least one blind through-hole at locations facing said space or said cavity covered by said metal cover;
• and
• (d) a heat conduction pathway having opposite ends, one pathway end disposed for receiving heat from said enclosed space, and the other pathway end disposed for transmitting heat to the environment.