Process for producing a printed wiring board

A process for producing a printed wiring board, comprising the steps of:

• preparing a copper-clad laminate comprising a substrate having two main surfaces and copper-clad foils on the surfaces of the insulating board, the copper-clad laminate having a through-hole;
• forming a first resist pattern on the surfaces of the copper-clad laminate, the first resist pattern including an area of the through-hole and an area where a conductor pattern is to be formed;
• etching the copper-clad composite with the first resist pattern as a resist to remove the copper-clad foils in an area not covered by the first resist pattern;
• removing the first resist pattern from the copper-clad composite;
• conducting an electroless plating to form an electroless plating copper layer on the surfaces of the copper-clad composite including the internal surface of the through-hole;
• forming a second resist pattern on the surfaces of the copper-clad composite such that only an area of the through-hole, an area of a land portion and an area of a foot print portion for a surface mounting part, of the copper-clad composite, are not covered by the second resist pattern;
• conducting an electroplating to form an electroplating copper layer on the surfaces of the copper-clad composite on areas not covered by the second resist pattern;
• conducting an electroplating to form a metallic resist plating layer on the electroplating copper layer;
• removing the second resist pattern from the copper-clad composite;
• and
• removing the exposed electroless plating copper layer from the copper-clad composite.