Printed circuit board
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsPinghua Duan, Lei Zhang, Zhan Ying
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.
Claims16
A printed circuit board, PCB, comprising:
- a plated through hole;
- a solder pad covering the through hole at both ends of the through hole;
- and
- at least two pins plugged into the through hole, each of the at least two pins having a pin head end, one of the at least two pin head ends being in thermal contact with one of the solder pads, and another of the at least two pin head ends being in thermal contact with the other solder pad, the at least two pins being thermal contacted with one another.
A printed circuit board, PCB, comprising:
- a plated through hole;
- a solder pad covering the through hole at both ends of the through hole;
- and
- two pins plugged into the through hole, each of the two pins having:
- a pin head end, one of the at least two pin head ends being in thermal contact with one of the solder pads, and another of the at least two pin head ends being in thermal contact with the other solder pad, the two pins being in thermal contact with one another, a first pin of the two pins further comprises a body and a tuber proximate its head end, the tuber being made of glue and the tuber being at one side of the body other than a side which it is thermal contact with the other pin, a pin of the two pins having an interference fit with inner surface of the plated through hole;
- and
- a tail end, each tail end comprising a chamfer.
Dependencies are inferred from the claim text.