Method for Manufacturing a Sheet with Double-Sided Structured Conducting Layers for Electronic Applications

Abstract

A method is provided, having providing an electrically insulating substrate and forming a through-hole in the substrate between a first and a second main surface region of the substrate. Additionally, the method has a structured deposition of conductive material on the first main surface region of the substrate, so that walls of the through-hole are covered by the conductive material and so that first conductive traces are formed on the first main surface region of the substrate; and a structured deposition of further conductive material on the second main surface region of the substrate so that second conductive traces are formed on the second main surface region of the substrate.

Dependencies are inferred from the claim text.