H01J 37/3411
Constructional aspects of the reactor
Official title: {Constructional aspects of the reactor}
H01J37/3411 (Constructional aspects of the reactor) appears on 2,482 US grants and 2,964 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,482
- Published applications
- 2,964
- Assignees
- 782
- Inventors
- 4,813
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 7 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 13 | 0 |
| 1984 | 21 | 0 |
| 1985 | 7 | 0 |
| 1986 | 16 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 16 | 0 |
| 1990 | 7 | 0 |
| 1991 | 14 | 0 |
| 1992 | 24 | 0 |
| 1993 | 32 | 0 |
| 1994 | 36 | 0 |
| 1995 | 39 | 0 |
| 1996 | 42 | 0 |
| 1997 | 43 | 0 |
| 1998 | 41 | 0 |
| 1999 | 40 | 0 |
| 2000 | 39 | 0 |
| 2001 | 65 | 17 |
| 2002 | 65 | 39 |
| 2003 | 40 | 39 |
| 2004 | 45 | 65 |
| 2005 | 25 | 69 |
| 2006 | 23 | 84 |
| 2007 | 13 | 86 |
| 2008 | 12 | 84 |
| 2009 | 25 | 99 |
| 2010 | 38 | 105 |
| 2011 | 38 | 125 |
| 2012 | 45 | 115 |
| 2013 | 68 | 136 |
| 2014 | 69 | 159 |
| 2015 | 109 | 202 |
| 2016 | 105 | 189 |
| 2017 | 158 | 192 |
| 2018 | 139 | 171 |
| 2019 | 126 | 140 |
| 2020 | 136 | 156 |
| 2021 | 109 | 136 |
| 2022 | 128 | 169 |
| 2023 | 118 | 132 |
| 2024 | 120 | 119 |
| 2025 | 132 | 83 |
| 2026 | 61 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01J 37/3414Targets1,266
- H01J 37/345Magnet arrangements in particular for cathodic sputtering apparatus628
- H01J 37/3435Target holders440
- H01J 37/3447Collimators, shutters, apertures330
- H01J 37/3444Associated circuits190
- H01J 37/3441Dark space shields179
- H01J 37/3438Electrodes other than cathode148
- H01J 37/3461Means for shaping the magnetic field54
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Physical vapor deposition system and methods of operating the same29 Sep 2026US 12,747,492 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing transparent conductive coatings for emi protection using hipims8 Oct 2026US 2026/0308745 A1Raytheon Company
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Online adjustment of magnet bars in magnetrons1 Oct 2026US 2026/0302147 A1Soleras Advanced Coatings BV
- Plasma processing apparatus1 Oct 2026US 2026/0302148 A1Ulvac, Inc.
Most cited
By later US patents
- Stationary aperture plate for reactive sputter deposition566US 5,415,753 AMaterials Research Corporation · 1995
- Process kit and target for substrate processing chamber379US 9,127,362 B2APPLIED Materials.Inc. · 2015
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Sputtering system using cylindrical rotating magnetron electrically powered using alternating current260US 5,814,195 AThe BOC Group, Inc. · 1998
- Spark eliminating sputtering target and method for using and making same238US 5,922,176 ADonnelly Corporation · 1999