H01J 37/3435
Target holders
Official title: {Target holders (includes backing plates and endblocks)}
H01J37/3435 (Target holders) appears on 440 US grants and 546 published applications in this corpus.
Search patents in H01J- Granted patents
- 440
- Published applications
- 546
- Assignees
- 229
- Inventors
- 1,120
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 6 | 9 |
| 2003 | 8 | 7 |
| 2004 | 10 | 13 |
| 2005 | 5 | 16 |
| 2006 | 6 | 19 |
| 2007 | 1 | 26 |
| 2008 | 3 | 19 |
| 2009 | 4 | 17 |
| 2010 | 10 | 26 |
| 2011 | 7 | 28 |
| 2012 | 10 | 20 |
| 2013 | 13 | 21 |
| 2014 | 13 | 26 |
| 2015 | 15 | 26 |
| 2016 | 16 | 29 |
| 2017 | 22 | 29 |
| 2018 | 24 | 29 |
| 2019 | 22 | 27 |
| 2020 | 26 | 32 |
| 2021 | 24 | 21 |
| 2022 | 28 | 38 |
| 2023 | 24 | 22 |
| 2024 | 20 | 17 |
| 2025 | 24 | 19 |
| 2026 | 11 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Physical vapor deposition system and methods of operating the same29 Sep 2026US 12,747,492 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Molybdenum sputtering target assembly and method of making11 Aug 2026US 12,703,907 B2Solstice Advanced Materials US, Inc.
- Wafer edge profile control using connected edge ring hardware14 Jul 2026US 12,683,136 B2APPLIED Materials.Inc.
- In situ and tunable deposition of a film16 Jun 2026US 12,655,515 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Diffusion bonded tungsten containing target to titanium or titanium alloy backing plate2 Jun 2026US 12,644,174 B2Solstice Advanced Materials US, Inc.
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Thin film forming device2 Jul 2026US 2026/0185211 A1Samsung Display Co., Ltd.
- Scanning Magnetron Device and Magnetron Sputtering Apparatus for PVD Planar Target23 Apr 2026US 2026/0112591 A1Arrayed Materials (China) Co., Ltd.
Most cited
By later US patents
- Sputtering process and apparatus180US 4,166,018 AAirco, Inc. · 1979
- Sputtering target assembly having solid-phase bonded interface126US 5,693,203 AJapan Energy Corporation · 1997
- Integrated sputtering target assembly93US 5,565,071 AAPPLIED Materials.Inc. · 1996
- Apparatus and method for manufacturing planarized aluminum films80US 4,661,228 AVarian Associates, Inc. · 1987
- Sputtering device and target with cover to hold cooling fluid76US 5,433,835 AAPPLIED Materials.Inc. · 1995