H01J 37/34
Operating with cathodic sputtering
Official title: operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34})
H01J37/34 (Operating with cathodic sputtering) appears on 3,567 US grants and 3,925 published applications in this corpus.
Search patents in H01J- Granted patents
- 3,567
- Published applications
- 3,925
- Assignees
- 1,077
- Inventors
- 6,521
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 12 | 0 |
| 1978 | 11 | 0 |
| 1979 | 17 | 0 |
| 1980 | 10 | 0 |
| 1981 | 9 | 0 |
| 1982 | 9 | 0 |
| 1983 | 38 | 0 |
| 1984 | 46 | 0 |
| 1985 | 20 | 0 |
| 1986 | 31 | 0 |
| 1987 | 15 | 0 |
| 1988 | 17 | 0 |
| 1989 | 32 | 0 |
| 1990 | 26 | 0 |
| 1991 | 26 | 0 |
| 1992 | 41 | 0 |
| 1993 | 46 | 0 |
| 1994 | 53 | 0 |
| 1995 | 52 | 0 |
| 1996 | 61 | 0 |
| 1997 | 62 | 0 |
| 1998 | 66 | 0 |
| 1999 | 66 | 0 |
| 2000 | 89 | 0 |
| 2001 | 107 | 32 |
| 2002 | 121 | 76 |
| 2003 | 72 | 81 |
| 2004 | 92 | 116 |
| 2005 | 52 | 117 |
| 2006 | 34 | 134 |
| 2007 | 26 | 130 |
| 2008 | 28 | 119 |
| 2009 | 41 | 133 |
| 2010 | 58 | 141 |
| 2011 | 61 | 168 |
| 2012 | 62 | 142 |
| 2013 | 86 | 176 |
| 2014 | 96 | 208 |
| 2015 | 133 | 249 |
| 2016 | 137 | 225 |
| 2017 | 188 | 219 |
| 2018 | 165 | 199 |
| 2019 | 155 | 171 |
| 2020 | 158 | 202 |
| 2021 | 131 | 170 |
| 2022 | 153 | 218 |
| 2023 | 147 | 160 |
| 2024 | 149 | 166 |
| 2025 | 169 | 104 |
| 2026 | 83 | 69 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Shutter disc for a semiconductor processing tool6 Oct 2026US 12,753,488 B2Taiwan Semiconductor Manufacturing Company.Ltd
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Tubular sputter cathode29 Sep 2026US 12,747,491 B2BüHler Alzenau GmbH
- Physical vapor deposition system and methods of operating the same29 Sep 2026US 12,747,492 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing transparent conductive coatings for emi protection using hipims8 Oct 2026US 2026/0308745 A1Raytheon Company
- Sputtering System with a Plasma Monitoring Device and an Ion Source8 Oct 2026US 2026/0311978 A1Dah Young Vacuum Equipment Co., Ltd.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Online adjustment of magnet bars in magnetrons1 Oct 2026US 2026/0302147 A1Soleras Advanced Coatings BV
- Plasma processing apparatus1 Oct 2026US 2026/0302148 A1Ulvac, Inc.
Most cited
By later US patents
- Stationary aperture plate for reactive sputter deposition566US 5,415,753 AMaterials Research Corporation · 1995
- Process kit and target for substrate processing chamber379US 9,127,362 B2APPLIED Materials.Inc. · 2015
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Endocurietherapy293US 5,342,283 A1994
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993