H01J 37/3464
Operating strategies
Official title: {Operating strategies}
H01J37/3464 (Operating strategies) appears on 417 US grants and 578 published applications in this corpus.
Search patents in H01J- Granted patents
- 417
- Published applications
- 578
- Assignees
- 220
- Inventors
- 1,056
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 1 |
| 2004 | 2 | 2 |
| 2005 | 2 | 4 |
| 2006 | 0 | 3 |
| 2007 | 0 | 5 |
| 2008 | 2 | 8 |
| 2009 | 3 | 12 |
| 2010 | 3 | 17 |
| 2011 | 0 | 18 |
| 2012 | 5 | 14 |
| 2013 | 12 | 27 |
| 2014 | 7 | 20 |
| 2015 | 14 | 32 |
| 2016 | 16 | 45 |
| 2017 | 30 | 52 |
| 2018 | 34 | 43 |
| 2019 | 40 | 35 |
| 2020 | 33 | 41 |
| 2021 | 32 | 39 |
| 2022 | 29 | 34 |
| 2023 | 26 | 43 |
| 2024 | 41 | 38 |
| 2025 | 28 | 26 |
| 2026 | 22 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Coated cutting tool with an alternating layer composition6 Oct 2026US 12,752,344 B2Walter AG
- Method of operating a PVD apparatus22 Sep 2026US 12,745,577 B2SPTS Technologies Limited
- Film forming method and film forming apparatus8 Sep 2026US 12,729,426 B2Tokyo Electron Limited
- High power generator and method of supplying high power pulses1 Sep 2026US 12,725,760 B2Trumpf Huettinger Sp. Z O. O.
- Film formation apparatus and film formation method of gallium nitride film11 Aug 2026US 12,703,910 B2Japan Display Inc.
- Method for producing transparent conductive coatings for emi protection using hipims8 Oct 2026US 2026/0308745 A1Raytheon Company
- Wafer edge profile control using connected edge ring hardware24 Sep 2026US 2026/0290771 A1APPLIED Materials.Inc.
- Methods for Reshaping Masking Layer Openings10 Sep 2026US 2026/0271678 A1APPLIED Materials.Inc.
- Substrate processing apparatus for double-sided sputtering27 Aug 2026US 2026/0253851 A1Sea, Ltd.
- Method for manufacturing a nuclear fuel rod cladding and corresponding nuclear fuel rod cladding6 Aug 2026US 2026/0229379 A1
Most cited
By later US patents
- Stationary aperture plate for reactive sputter deposition566US 5,415,753 AMaterials Research Corporation · 1995
- Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source127US 5,556,521 AMaterials Research Corporation · 1996
- Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity101US 5,320,728 AAPPLIED Materials.Inc. · 1994
- Electrochromic devices97US 9,261,751 B2View, Inc. · 2016
- High voltage resistive output stage circuit84US 10,460,910 B2Eagle Harbor Technologies, Inc. · 2019